• Lead-Free Soldering capability Max. Temp. 315° C
  (600° F)
• 100% forced air convection
• Individual time and temp. microprocessor controls make
  profile set-up easy.
• All stainless steel interior construction
• Unique shuttle system enables higher throughputs than
  standard batch ovens
• Dual cooling zones
• Processes boards up to 12" x 12"
• Large viewing window on top enables viewing of entire
  reflow process
• N2 inerting option available.
• Available as a benchtop unit or with optional stand
  configuration.
  Please contact us for full details and specifications