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Multicore Lead-Free Solder Wire - 502

Multi Core
Part Number: Multicore Lead-Free Solder Wire - 502
  • No clean
  • Clear residue
  • Increased wetting speed
  • 955% SN, 38% Ag, 07% CU
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Description

  • No-clean, clear residue, minimal activation for increased wetting speed
  • Composition: 95.5% SN, 3.8% Ag, 0.7% CU
  • Halide Content: 0.2%
  • IPC Class: ROM1
  • Flux Content by Weight: 3%

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